1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+150oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.