1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits. 8. Environmental-friendly technology and complying with international standards.

1. Fast recovery time 2. Low forward voltage drop, low leakage current 3. Avalanche breakdown protection 4. Excellent resistance to CRT high voltage surge current discharge impact 5. Axial leading wires, and the pin is weldable 6. Epoxy package with anti-corrosion properties on surface

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.