1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 40ns. 3. High heat resistance,PN junction temperature peak 150℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 75ns. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

Product Description Adjustable high precision and high voltage stabilized power supplies, ion generators, high voltage resistance testers (high voltage resistance screening, glass glaze resistor), high voltage diode withstand voltage testers, xenon lamp testers 0~2KV/5KV/10KV/20KV HV-20KV-Ⅲ. 1.Applications: A: High precision high voltage stabilized power supply experiment B: Insulation resistance testing of electrical equipment C: High voltage capacitance withstand voltage testing D: IGBT testing, high voltage diode withstand voltage testing, leakage current testing E: MOS、BJT、controlled silicon diode screening F: Xenon lamp tests preignition voltage G: Glass glaze resistor performance testing

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 150ns. 3. High heat resistance,PN junction temperature peak 130℃. 4. Environmentally friendly process,international standards. 5. Using epoxy resin molding vacuum package, with corrosion resistant surface.

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 40~65ns. 3. High heat resistance,PN junction temperature peak 150℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface