1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.