1. Adopting international latest technology for the production of die chips assembly 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+130 oC.. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits.

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 150ns. 3. High heat resistance,PN junction temperature peak 130℃. 4. Environmentally friendly process,international standards. 5. Using epoxy resin molding vacuum package, with corrosion resistant surface.

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 40~65ns. 3. High heat resistance,PN junction temperature peak 150℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 80~100ns. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface