1. Adopting state of art Chip combination ?design 2. Low leakage current, surge resistance, impact resistance, avalanche breakdown protection characteristics. 3. Various of dimensions can be chose or customized. 4. High heat resistance, PN junction temperature up to 150 ℃ 5. environmental protection ?process, be consistent with international standards

1. Low leakage,low power loss,high reliability. 2. Excellent Instantaneous large current shock resist features. 3. Good Reverse avalanche breakdown features 4. Tj:-40℃——+125℃ 5. Various of dimensions can be chose or customized. 6. Environmental protection ?process, be consistent with international standards

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. High efficiency cooling ceramic package 2. Excellent high temperature performance 3. Silicon chip adopts gold coated technology 4. High chip integration 5. Reliable connection and easy to install

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 150ns. 3. High heat resistance,PN junction temperature peak 130℃. 4. Environmentally friendly process,international standards. 5. Using epoxy resin molding vacuum package, with corrosion resistant surface.

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 40~65ns. 3. High heat resistance,PN junction temperature peak 150℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface