1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 80~100ns. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 130℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits. 8. Environmental-friendly technology and complying with international standards.

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 80ns. 3. High heat resistance,PN junction temperature peak 175℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Low leakage,resistant to surge ,resistant to shock. 2. Great avalanche voltage breakdown protection features. 3. High heat resistance,PN junction temperature peak 175℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. Reverse recovery time Trr60～150nS 8. High voltage rectifier, isolation and protective effect in circuits. 9. Environmental-friendly technology and complying with international standards.

1. Adopting international latest technology for the production of die chips 2. Low leakage current, low power, high reliability. 3. Excellent impact resistance for instantaneous high current. 4. Reverse avalanche breakdown. 5. Working temperature-40 oC. ~+175 oC. 6. Various sizes or customized 7. High voltage rectifier, isolation and protective effect in circuits. 8. Environmental-friendly technology and complying with international standards.

1. Low leakage,resistant to surge ,resistant to shock. 2. High-speed transfer switch reaction ,reverse recovery time for 100ns. 3. High heat resistance,PN junction temperature peak 175℃ 4. Environmentally friendly process,international standards 5. Using epoxy resin molding vacuum package, with corrosion resistant surface